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OFDMA changed that. By composing subcarriers into resource units (RU), OFDMA channels can dynamically divide the instantaneous bandwidth to different users. OFDMA has suddenly increased the number of users that are instantly supported. The 20MHz bandwidth in the following figure is an example. Through subcarrier allocation, 20MHz can support up to 9 devices to access at the same time, 40MHz can support 18 devices, and so on. Fig. 2 uses the number of resource units available under OFDMA’s 20MHz% 0AWi-Fi 6 in which each subcarrier is 78.125khz. 20MHz is 256 subcarriers. 6 Edge indicates that there are 6 subcarriers as protection bands from the edge. ) It can be said that OFDMA has brought about a qualitative change in the capacity of Wi-Fi channels.
Then, as demand for cars picks up in the fall of 2020, Toyota Denso Renesa plans to order 28nm semiconductors from TSMC again, but there is no room to produce in-car semiconductors because TSMC lines are occupied by other semiconductors. Although the inventory in the autumn and winter of 2020 exceeded the limit, by 2021, inventory had bottomed out, coupled with the shortage of 28nm semiconductors, cars could not be made. 28nm is the last generation of planar transistors (FinFET from 16 / 14nm to 3D) (2) do not use self-aligned double pattern (SADP) (will use SADP from FinFET) (3) Renesas vertical integration (integrated equipment manufacturer IDM), for example, outsource production to FinFET from this generation. In short, 28nm semiconductors produced by TSMC and other contract factories have a good performance-to-price ratio, so many electronic devices, including automobiles, use this semiconductor. At the invitation of the Japanese government, the TSMC Kumamoto plant, which will begin operation in 2024, will also mainly produce such 28nm semiconductors.
The basic content of SoC definition is mainly in two aspects: one is its composition, and the other is its formation process. The composition of the system-level chip can be a system-level chip control logic module, a microprocessor/microcontroller CPU core module, a digital signal processor DSP module, an embedded memory module, and an interface module for external communication, and an ADC/DAC module. Analog front-end modules, power supply, and power management modules, for a wireless SoC there are also RF front-end modules, user-defined logic (which can be implemented by FPGA or ASIC), and micro-electromechanical modules, and more importantly, an SoC chip with embedded Basic software (RDOS or COS and other application software) modules or loadable user software, etc. The system-on-chip formation or generation process includes the following three aspects.
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