Printed circuit board assembly supplier today? What we provide is not only PCB & MCPCB manufacturing, but also including PCB duplicating, Engineering & process design, components management & sourcing solution, PCB in house assembly & full system integration, surface mounted technology (SMT), full products assembly & testing. See more details at printed circuit board manufacturers. One of the key concepts in electronics is the printed circuit board or PCB. It’s so fundamental that people often forget to explain what a PCB is. This tutorial will breakdown what makes up a PCB and some of the common terms used in the PCB world. Printed circuit board is the most common name but may also be called “printed wiring boards” or “printed wiring cards”. Before the advent of the PCB circuits were constructed through a laborious process of point-to-point wiring. This led to frequent failures at wire junctions and short circuits when wire insulation began to age and crack.
Double sided flex circuits consists with double sided copper conductors and can be connected from both sides. It allows more complicated circuit designs, more components assembled. The major material used are copper foil, polyimide and coverlay. Adhesiveless stack up is popular for better dimensional stability, high temperature, thinner thickness. Dual access flexible circuit board refer to the flex circuit which can be accessed from both top and bottom side but only has only layer of conductor trace. Copper thickness 1OZ and coverlay 1mil, it similar with 1 layer FPC and opposite side FFC. There’re coverlay openings on both sides of flex circuit so that there’re solderable PAD on both top and bottom sides, that is similar with double sided FPC, but dual access flex circuit board has different stack up because of only one copper trace, so no plating process is need to make plated through hole (PTH) to connect between top and bottom side, and trace layout is much more simple. Currently our mouthy capability is 260,000 square feet (28,900 square meter), more than 1,000 different boards will be completed. We also provide expediate service, so that urgent boards can be shipped out within 24 hours.
Tg means Glass Transition Temperature. As flammability of printed circuit board (PCB) is V-0 (UL 94-V0), so if the temperature exceeds designated Tg value, the board will changed from glassy state to rubbery state and then the function of PCB will be affected. If working temperature of your product is higher than normal (130-140C), then have to use High Tg PCB material which is > 170C. and popular PCB high value are 170C, 175C, and 180C. Normally the FR4 circuit board Tg value should be at least 10-20C higher than working temperature of product. If you 130TG board, working temperature will be lower than 110C; if use 170 high TG board, then maximum working temperature should be lower than 150C.
While Flexible PCBs offer significant advantages, they are also prone to damages. Broadly damages can accrue from two factors: environmental factors and problems that account for issues at the design/fabrication stages. Let us look at both these aspects in some detail. Several environmental factors can cause damage to PCBs, including moisture, static electricity, dust, extreme temperatures, chemical corrosion, and pests. For example, if the PCB is stored in an environment with a lot of moisture, it can destroy the flexible PCB. Moisture can result in a short. Also, given that molds can grow in a damp environment, it will result in a circuit failure. The storage area must be free of any static creating agents. Storing PCBs in carpeted rooms, for example, can result in damage to printed circuit boards on account of the static electricity generated.
According to different manufacturing method, current there’re three basic types for ceramic board: A) Thick Film Ceramic Board Thick Film Ceramic PCB: Using this technology, the thickness of conductor layer exceeds 10 micron, more thick than spurting technology. The conductor is silver or gold palladium, and was printed on ceramic substrate. More for Thick Film Ceramic PCB. B) DCB Ceramic Board DCB (Direct Copper Bonded) technology denotes a special process in which the copper foil and the core (Al2O3 or ALN), on one or both sides, are directly bonded under appropriate high temperature and pressure. Discover more details on https://www.bstpcb.com/.
The main difference between a FR4 board and MCPCB is the thermal conductivity dielectric material in the MCPCB. This acts as a thermal bridge between the IC components and metal backing plate. Heat is conducted from the package through the metal core to an additional heat sink. On the FR4 board the heat remains stagnant if not transferred by a topical heatsink. According to lab testing a MCPCB with a 1W LED remained near an ambient of 25C, while the same 1W LED on a FR4 board reached 12C over ambient. LED PCB always be produced with Aluminum core, but sometimes steel core PCB also be used.