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Orthogonal frequency division multiple access OFDMA: Friends who are familiar with Wi-Fi should know that the empty port of Wi-Fi adopts orthogonal frequency division multiplexing (OFDM) modulation, that is, the whole bandwidth is composed of orthogonal subcarriers. In Wi-Fi 6, the 802.11 working group introduced OFDMA access from LTE. The addition of such an “A” word can be said to have brought a qualitative change to the network capacity. As shown in the figure on the left below, Wi-Fi 5-based OFDM can only allocate all the bandwidth in the channel to one user at any one time, even if that user’s data needs do not need to take up all the bandwidth. When other users connect to the network, they need to wait for the next sending opportunity window (TXOP). This is very inefficient in the use of channel resources, especially when there is a significant increase in equipment.
With the increasing degree of automation of cars and electric vehicles, the number of semiconductors required will increase sharply. Most semiconductors are traditional analog and power semiconductors. These traditional analog and power semiconductors are produced by 8-inch factories. Because it is difficult to ensure 8-inch manufacturing equipment, it is difficult to add new 8-inch semiconductor factories. In short, self-driving cars certainly need state-of-the-art semiconductors to run advanced artificial intelligence (AI), but the need for a large number of traditional analog and power semiconductors has become the Achilles’ heel of automobile production, and it is not easy to solve this problem. Although the automobile industry has ushered in an once-in-a-century period of great change in CASE (Connected, Autonomous/Automated, Shared, Electric), it is also an era suffering from the shortage of semiconductors.
In the onboard system shown in the figure above, the green rectangle represents the printed circuit board (PCB), and the small rectangles of various colors above represent various functional modules in the system, such as memory. The functions of these modules are implemented by independent silicon chips, and they are connected by metal traces on the PCB to finally form a complete system. The System-on-Chip refers to the realization of the functions of the entire system on a single silicon chip. The schematic diagram is as follows: As shown in the figure above, a system-on-a-chip (SoC) implements various functional modules such as storage, processing, logic, and interfaces in one chip, rather than requiring several different physical chips to be implemented like a system-on-board. Compared with system-on-board, SoC solutions are lower cost, enable faster and more secure data transfer between different system units, have higher overall system speed, lower power consumption, smaller physical size, and better reliability.
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